7800 Neutral Curing Structural Glazing Silicone Sealant For Curtain Wall
Features &Benefits
1. One-component, neutral curing, high strength, high adhesion, medium and high modulus.
2. It can achieve excellent bonding and sealing performance with most building materials without primer, and has good extensibility, watertightness and other functions;
3. After curing, the product forms a cold-resistant, heat-resistant, non-corrosive elastomer with excellent weather resistance, anti-aging, UV resistance, ozone resistance and high and low temperature resistance, and no pollution to the environment.
4. It has good compatibility with other Haoqian silicone glues.
Product Information
| Test project | Unit | value |
| Flow, sagging or vertical flow | mm | 0 |
| Operating time | min | 20 |
| surface drying time(25ºC,50%R.H.) | min | 40-60 |
| Durometer Hardness | Shore A | 20-60 |
| At 23 ºC maximum tensile strength
elongation |
% | ≥100 |
| Tensile strength(23ºC) | Mpa | 0.9 |
| Tensile strength(90ºC) | Mpa | 0.68 |
| Tensile strength(-30ºC) | Mpa | 0.68 |
| Tensile strength(flooding) | Mpa | 0.68 |
| Tensile strength(flooding - ultraviolet) | Mpa | 0.68 |
| Bond damage area | % | 5 |
| Thermal aging(thermal weight loss) | % | ≤5 |
| Thermal aging(crack) | No | |
| Thermal aging(efflorescence) | No |
Applications
1. Structural bonding, assembly and sealing of glass curtain walls, stone (marble, granite) curtain walls, aluminum panel curtain walls and metal structure projects.
2. Suitable for misjoining or docking between glasses and bonding and sealing of lighting roofs.
3. Sealing and bonding in high-rise buildings and industrial applications.
4. Suitable for semi-hidden frame or fully hidden frame engineering curtain wall design and other types of construction and industrial sealing.
Construction summary
1. Not suitable for all surfaces exuding grease, plasticizers or solvents.
2. It should not be used in closed spaces or on surfaces that are in direct contact with food or drinking water.
3. It is not suitable for construction when the surface temperature of the base material is lower than 4℃ or exceeds 40℃.
4. It is not suitable to bond substances containing copper or copper alloy.
